Dual-Mass Linear Vibration Silicon-Based MEMS Gyroscope

This book introduces the key technologies in the manufacture of double-mass line vibrating silicon micromechanical gyroscope, respectively. The design of gyrostructure, detection technology, orthogonal correction technology, the influence of temperature and the design of measurement and control system framework are introduced in detail, with illustrations for easy understanding.

It presents the principle, structure and related technology of silicon-based MEMS gyroscope. The content enlightens the researchers of silicon-based MEMS gyroscopes and gives readers a new understanding of the structural design of silicon-based gyroscopes and the design of dual-mass gyroscopes.

Chapter 1 Introduction.- Chapter 2 Silicon-based MEMS gyroscope structure and working principle.- Chapter 3 Silicon-based MEMS gyroscope structure noise analysis and system model.- Chapter 4 Silicon-based MEMS gyroscope quadrature error correction technology and optimization.- Chapter 5 Silicon-based MEMS gyroscope sense closed loop and frequency tuning technology.- Chapter 6 Temperature influence on MEMS gyroscope and suppression method.- Chapter 7 Silicon-based MEMS gyroscope monitoring circuit design and test technology.- References.

Hui Liang Cao received the Ph.D. degree in instrument science and technology from Southeast University, Nanjing, China, in 2014. From 2011 to 2012, he studied as a research Ph.D. student in School of Electrical and Computer Engineering in Georgia Institute of Technology, Atlanta, USA. He is one of the top young academic leaders of Higher Learning Institutions of Shanxi and young academic leaders of North University of China. He is currently a postgraduate tutor and associate professor of the School of Instrument and Electronics in North University of China, Taiyuan, Shanxi, China. His research interests include the areas of MEMS inertial devices, and he has published more than 30 papers in journals and conference proceedings as the first author. He is an IEEE member and a fellow of micro nano technology association of China and automation association of China.